Society for Science & the Public is seeking a new title sponsor for the International Science and Engineering Fair, the world’s largest international high school STEM (science, technology, engineering and math) competition.
Intel became the title sponsor in 1997 and renewed that sponsorship through 2019. A new sponsor will assume the sole title sponsorship following the May 2019 event.
Hundreds of thousands of young researchers from across the world enter this powerful STEM pipeline. Last year, more than 1,750 finalists from over 75 countries, regions and territories convened in Phoenix for the weeklong event. These students — tomorrow’s leading scientists, engineers, innovators and entrepreneurs — strive to discover answers and develop new solutions to humankind’s greatest problems.
Cutting-edge independent research projects presented last year included studies of the genes that help microbes turn waste into electricity, investigations of improved electrolytes for batteries and the development of a smart leg brace for people with multiple sclerosis, spinal injury or other problems walking.
“This competition and its affiliated science fairs held across the globe reach young people like no other program can, igniting their passion for science and their desire to discover innovative solutions to some of our world’s most intractable problems,” says Maya Ajmera, president and CEO of Society for Science & the Public and publisher of Science News.
Over the competition’s nearly 70 years, the International Science and Engineering Fair has yielded thousands of distinguished alumni. Counted among the ranks are top innovators and entrepreneurs as well as recipients of the world’s most coveted science and math honors including the Nobel Prize, National Medal of Science, Breakthrough Prize, Lasker Award and MacArthur Fellowship.
For more information on the search for a title sponsor, visit www.societyforscience.org/future-isef.